Semiconductor Packaging Simulation

Advanced semiconductor package testing for improved product quality

Ever-shrinking form factors, more complex product integration and growing environmental compliance demands make semiconductor package performance and reliability improvement ever more challenging. Virtual testing using realistic simulation software offers packaging engineers the ability to gain time in assuring requirement compliance while minimizing total product cost and time to market.

The Semiconductor Packaging Simulation solution reduces the need for fabricating test prototypes by substituting virtual testing and lifecycle prediction. Modern progressive fracture/failure capabilities, best-in-class solver performance and interactive programming capabilities enable efficient model generation and preparation. Supported simulation methods enable robust coupled-field analysis of thermal, electrical, mechanical and moisture-sensitivity load regimes. Engineers are able to predict complex real-world behavior with best-in-class steady-state and transient analyses. The solution provides detailed insight into the product behavior under a variety of manufacturing, shipping and operating conditions.