Device Thermal Performance

Facilitate optimizing the thermal behaviour of innovative electronic devices

Temperature is a critical factor in delivering optimal, safe user experiences with high-tech devices. However, with innovative chip and battery designs, shrinking form factors and diverse environmental conditions, the management of heat is becoming ever more complex. 

The Device Thermal Performance solution scales from simulating simple heat transfer analysis up to complex temperature-displacement simulation in which motion affects heat transfer and vice versa. The solution's thermal simulations accurately predict real world transient airflow conditions on even the most complex geometries. It enables the early and precise analysis of cooling airflow, component placement and thermal shielding, helping to avoid costly late-stage design fixes or even lifetime failures.